Re: Lifetime of Al bond pad

Auget analysis of an example pad should tell you if there are any contaminants or oxides.

Regards,
Mike

Volker Nitsche wrote:

> "Alex Kaiser" <[EMAIL PROTECTED]> wrote in
> news:[EMAIL PROTECTED]: 
>
> > Maybe oxidation is the main problem if the samples were lying aroun
> > for several years.
> > What about trying to bond one of these?
> > If it don't work, maybe a short dip in thinned phosphoric acid may
> > help. I have never tried it, so be careful.
>
>
> They have been in one of those plastic boxes used for wafer 
> transportation. Basically it is sealed, but of course gas can penetrate 
> although slowly and I do not know what those boxes will outgas over time.
>
> I do not dare to tell Production to use some acid. I do not even want to 
> think what might happen .... ;-)
>
> We have bonded on a couple of lots and do not see any concerns so far.
>
> Another source claimed the Al could lump together and we could experience 
> lifted metallization. We have done some temp cycling and couldn't found 
> anything.
>
> Let's see...
>
> Regards
> Volker