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thanks a lot. [EMAIL PROTECTED] (John Damiano) wrote in message news:<[EMAIL PROTECTED]>... > Jzhao, > > Polishing W with selectivity to SiO2 is fairly common at the ILD0 > level (contact plug or local interconnect levels). Check with Rodel - > they have several products and can probably provide guidance w.r.t. > the appropriate pads, pad conditioner, slurry, etc. > > website: http://www.rodel.com/rodel/products/CMP.asp?caid=322 > > Good luck > > John Damiano > Protochips Inc. > > [EMAIL PROTECTED] (jialin zhao) wrote in message news:<[EMAIL PROTECTED]>... > > Dear all, > > I have some difficuty developing our in house CMP process. We plan to > > set up a CMP process of our own in the clean room. Basically we want > > to polish sputtering W by hand. we are buying wafer holder, polishing > > cloth, polishing pad, slurries, etc now. I wonder if anyone has > > experience and would give suggestions. I specifically interested in > > which kind of slurry have high selectivity over thermals silcion > > oxide. > > thanks a lot. > > my email is [EMAIL PROTECTED]
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