Timing Analyzer - delay to die pad or package pin?

Hi,

I have a question about the Xilinx Timing Analyzer (trce).

Does it report the I/O timing at the die pad or the package pin /
ball?

I believe the 5.x and earlier versions of the software referred timing
to the die pads, whereas 6.x seems to be taking the flight delay of
the package into account.
Could someone from Xilinx please confirm whether this is the case?

Thanks,
Allan