Re: BGA packages in high vibration environments

Followup to:  <[EMAIL PROTECTED]>
By author:    rickman <[EMAIL PROTECTED]>
In newsgroup: comp.arch.fpga
> 
> I recently saw a product that allows visual inspection of the solder
> balls on a mounted BGA.  It is a fiber optic microscope and has tiny
> fiber probes that can run between the balls.  I'll look for the info if
> anyone is interested.  
> 

A lot of people seem to do X-ray inspection, which I guess could be
considered "visual" in some way.

        -hpa
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